Injection molding monitoring system

Advantages of introduction

Advanced molding quality control through multivariable integrated monitoring

By synchronizing and displaying on a common time axis not only the resin pressure, resin temperature, mold surface temperature, and mold opening inside the mold, but also information from third-party measuring devices and injection molding machines via analog voltage input, advanced analysis becomes possible. In addition, by setting a monitoring range for the waveform obtained during good product molding (reference waveform), the system can output an alarm signal when a waveform falls outside this range, making it useful for defect monitoring in mass production molding.

  • Simultaneous monitoring at up to 24 points

    The MVS08 is capable of measuring up to 8 points simultaneously, including resin pressure, resin temperature, mold surface temperature, and mold opening, with a single unit. Furthermore, by connecting up to three additional units, it is possible to measure a total of up to 24 points in real time. This allows for flexible support in cases where multi-point measurement is required, such as installing various sensors in each cavity of a multi-cavity mold.

    Standalone functionality ideal for mass production molding

    Up to 10 measurement settings can be saved on the amplifier itself, allowing you to change the settings using only the amplifier without the need for a PC. In addition, if a USB flash drive is connected to the amplifier, measurement data will be automatically saved, making it possible to record data over a long period even without a dedicated PC for data storage.

    A system that can measure resin pressure, resin temperature, mold surface temperature, and mold opening amount in an integrated manner.

Features

By using the injection molding monitoring system, you can connect various sensors, such as pressure sensors, resin temperature sensors, mold surface temperature sensors, and mold opening measurement sensors, and measure a wide range of data. In addition, the system can integrate information from third-party measuring devices and injection molding machines. A lineup of dedicated direct pressure sensors utilizing the piezoelectric effect of quartz is also available for this system.
Through multivariable integrated monitoring, it is possible to verify the correlations among different measurement factors, determine appropriate settings when starting molding under different environments, and monitor defects during mass production molding, enabling a wide range of applications.

  • Measurement waveforms of the injection molding monitoring system

    Waveform measured by integrating resin pressure, resin temperature, mold surface temperature, and mold opening amount

Types of measurement amplifiers and sensors

  • Injection molding monitoring system<br /> MVS08

    Injection molding monitoring system
    MVS08

    • In addition to resin pressure, resin temperature, mold temperature, and mold opening, information from external devices can also be imported via analog voltage input.
    • Various measurement data can be easily integrated and displayed on a unified time axis using dedicated measurement software.
    • Equipped with functions for setting alarm monitoring ranges and outputting control signals.
    • By connecting three amplifiers, it is possible to simultaneously measure up to 24 channels (8 channels per unit).
    • Even in a standalone condition, it is possible to conduct monitoring, alarm output, and data recording.
    • The measurement software supports language switching between Japanese, English, Korean, Simplified Chinese, and Traditional Chinese.
  • Direct pressure sensor<br /> SPF04.0×08.0×030

    Direct pressure sensor
    SPF04.0×08.0×030

    • The product can measure the pressure inside the mold at a high accuracy (nonlinearity: ±1.0%F.S.).
    • Its flush-mount shape has achieved a highly flexible sensor installation position.
  • Mold open measurement sensor MEL series

    Mold open measurement sensor
    MEL Series

    • The mold opening amount at the parting line can be measured with micron-level precision.
    • Since a magnetic induction system is used, high-precision measurement is possible even at elevated temperatures.
    • In addition to injection molding machine molds, the sensor can also be installed on press molds and other types of molds.
  • Pressure relay amplifier UPP01A for MVS08

    Pressure preamplifier for MVS08
    UPP01A

    • This is a pressure preamplifier for MVS08.
    • A pressure sensor can be connected to a piece of this product without using an existing pressure measurement amplifier.
  • MVS08 Resin Temperature Relay Amplifier UPI01A

    Resin temperature preamplifier for MVS08
    UPI01A

    • This is a resin temperature preamplifier for MVS08.
    • One resin temperature sensor can be connected to each relay amplifier without using an existing resin temperature measurement amplifier.
  • Mold surface temperature preamplifier for MVS08<br /> UPT01A

    Mold surface temperature preamplifier for MVS08
    UPT01A

    • This is a mold surface temperature preamplifier for MVS08.
    • One mold surface temperature sensor can be connected to each relay amplifier without using a commercially available signal converter.
  • UPQ01A Direct Pressure Relay Amplifier for MVS08<br /> UPQ01A

    UPQ01A Direct Pressure Relay Amplifier for MVS08
    UPQ01A

    • This is a direct pressure preamplifier for MVS08.
    • One direct pressure sensor can be connected to each relay amplifier.
  • MPD200F MVS08 mold opening relay amplifier

    Mold open preamplifier for MVS08
    MPD200F

    • This is a mold open preamplifier for MVS08.
    • One mold opening measurement sensor can be connected to each one of preamplifier.

Sensor that can be connected to MVS08

  • Pressure sensor: ejector pin type SSE series

    Pressure sensor: ejector pin type SSE series

    • Due to its ejector pin shape, this product can replace the existing ejector pin. (*2)
    • The pin section can be cut in accordance with the mold.
    • The overall length of the pin can be specified as desired.
    • *1 It is necessary to combine this product with pressure measurement amplifier MPS08B.
    • *2 Machining such as flange cutting to prevent rotation is not possible.
  • Pressure sensor: button type SSB series

    Pressure sensor: button type SSB series

    • Since measurement is performed by placing the sensor directly beneath the ejector pin, the ejector pin currently in use can be utilized as is.
    • This product can be applied to a “small-diameter pin,” “square pin,” “pin with irregular tip shape,” and “pin with cut collar,” which cannot be measured by the ejector pin type.
    • A wide variety of rated capacities are available, ranging from 50 N to 16 kN.
    • A lineup of heat-resistant specifications that can withstand mold temperatures up to 200°C
    • *1 It is necessary to combine this product with pressure measurement amplifier MPS08B.
  • Pressure sensor Button type Wiring storage type<br /> SCB series

    Pressure sensor Button type Wiring storage type
    SCB series

    • Cables can be stored inside a wiring storage-type junction box, reducing the risk of cable disconnection.
    • We offer low-capacity models with a width of 3.5 mm and a pin diameter of φ0.3 to φ1.0 that can be applied to a low-pressure range with a recommended measurement range of 5 to 10 N (rating capacity: 10 N).
    • We also offer heat-resistant products that are applicable to mold temperature of up to 200˚C.
    • *1 It is necessary to combine this product with pressure measurement amplifier MPS08B.
  • Resin temperature sensor: ejector pin type EPSSZL series

    Resin temperature sensor: ejector pin type EPSSZL series

    • Infrared ray detection method that uses optical fiber
    • High responsiveness: 8 ms (at time of 63.2％ response)
    • Resin temperature in the range of 60˚C to 430˚C can be measured.
    • The ejector pin shape allows easy incorporation in a mold. (*1)
    • With the minimum tip diameter of φ1.7 mm, the product is also applicable to small-size mold products.

    *1 Machining such as flange cutting to prevent rotation is not possible.

  • Resin temperature sensor: flush-mount type EPSSZT series

    Resin temperature sensor: flush-mount type EPSSZT series

    • Infrared ray detection method that uses optical fiber
    • High responsiveness: 8 ms (at time of 63.2％ response)
    • Resin temperature can be measured in the range of 60˚C to 390˚C.
    • Its flush-mount shape has achieved a highly flexible sensor installation position.
  • Mold surface temperature sensor: STF

    Mold surface temperature sensor
    STF

    • As a sensor for injection molding mold, the product boasts a rigid design that withstands a mold temperature of up to 220˚C and resin pressure of up to 150 MPa.
    • Due to the employment of a K thermocouple, this product allows a general-purpose temperature measurement instrument and a data logger to conduct measurement, which enables the introduction of the sensor at a low cost.
    • With the minimum tip diameter of φ1, the product can also be applied to small-size mold products.

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